SPADE Center Charging Scheme

EQUIPMENT LIST

BASIC RATE (HK$)

Manual Decapsulation

$160 - $920 / device ^†

Wet Etch

$150 - $320 / layer ^††

ESD Tester

$980 / hour

Confocal Microscope

$980 / hour

Stereomicroscope

$200 / hour ^*

Liquid Crystal Thermal Analysis

$1,410 / hour

Mechanical Cross-section

$1,050 / hour

Grinding and Polishing

$1,050 / hour

Probe Station

$800 / hour

Active Probe Arm

$350 / hour ^*

General Electrical Instrument
(Oscilloscope, Signal Generator, etc.)

$280 / hour ^*

Curve Tracer

$230 / hour ^*

Ultrasonic Cleaner

$115 / hour ^*

Consultation

$575 / hour

Labour ^**

$400 / hour

Encapsulation

$820 / hour

Manual Wire Bonding (Aluminum)

$460 / hour

Burn-in Oven

$500 (first hour), $30 / hour (subsequent hours)

    * No technical assistance provided (self-operate by user)
  ** Labour charge refers to the technical assistance of using Stereomicroscope, General Electrical Instrument,
       Curve Tracer and Ultrasonic Cleaner.

       Please note that technical assistance will be provided to the above equipment without a "*" or "**".

    † Charging rates for manual decapsulation:
          COG package – HK$920 / device (remove die from glass panel)
          COF package – HK$460 / device (remove die from film)
          COB, TAB packages – HK$460 / device
          TQFP package (pin count less than 100) – HK$230 / device
          QFP package (pin count less than 100) – HK$230 / device
          SOIC, DIP, PLCC packages – HK$230 / device
          TSOP package (pin count more than 18) – HK$230 / device
          SSOP package (pin count more than 20) – HK$230 / device
          QFN-5x6 package – HK$310 / device
          QFN-3x3 package – HK$460 / device
          Micro-8, Micro-10 packages – HK$160 / device
       Please note that BGA package and extremely small size packages cannot be successfully decapsulated manually.
       Packages not listed above are subject to charge evaluation.
       Packages with copper bonding wires are subject to charge evaluation.

  †† Charging rates for wet etch delayering are as follows (limited to two layer metal device):
          Delayering polyimide – HK$320 / layer / device
          Delayering dielectric – HK$320 / layer / device
          Delayering polysilicon – HK$320 / layer / device
          Delayering metal – HK$150 / layer / device

Note:

The new charging rate will be effective from 1 Jul 2024.
Office hours of the SPADE Center:
9:00 a.m. to 5:30 p.m. (Mondays to Fridays) and 9:00 a.m. to 12:00 p.m. (Saturdays)
Jobs performed on Sundays and public holidays will be charged at 2 x basic rate.
Jobs performed during non-office hours (except Sundays and public holidays) of the SPADE Center will be
charged at 1.5 x basic rate.
Except Sundays and public holidays, jobs preempting other jobs on queue will be charged at 1.5 x basic rate.
All hourly-charged services are charged per 15-minute or part thereof, with a minimum charge of one hour,
for each individual service performed within a single day.